M5 Pro & M5 Max Feature Vertically Stacked Dies That Mimic 3D Packaging, According To Apple’s Platform Architecture Employee, Enabling Unrivaled Performance
An Apple employee states that the M5 Pro and M5 Max sport a new chiplet design where the dies are stacked vertically on top of one another
Wccftech
via Wccftech
Updated 2h ago
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Corroboration Score: 1This story was independently reported by 1 sources. Click any source to read the original article.
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